Manufacturing automation of in-situ temperature compensation information

ABSTRACT

An in-situ temperature compensation method of an electronic device and an associated temperature sensor includes providing airflow from a vortex air gun to a board including the electronic device and the associated temperature sensor; determining an associated offset at various temperatures in an operating range; and creating and storing a calibration table in memory including the associated offsets at the various temperatures, the calibration table is used during operation of the electronic device for compensation due to temperature variation. A system includes a board, an electronic device disposed to the board; a temperature sensor disposed on the board; a processor disposed to the board and communicatively coupled to the electronic device and the temperature sensor; and instructions that cause the processor to determine an associated offset at various temperatures in an operating range, and create and store a calibration table in memory with the associated offsets at the various temperatures.

FIELD OF THE DISCLOSURE

The present disclosure generally relates to manufacturing automationsystems and methods. More particularly, the present disclosure relatesto manufacturing automation of in-situ temperature compensationinformation of electrical components.

BACKGROUND OF THE DISCLOSURE

Some electronic components such as Oven-Controlled Crystal Oscillator(OCXO) have performance variation with temperature. Such electroniccomponents have to be characterized in manufacturing to determine howeach particular device varies with temperature for calibration. Thischaracterization is used to derive a calibration table to operate theelectronic components at varying temperatures. One existing solution toOCXO temperature variation is to use a more expensive oscillator, suchas using Rubidium. However, such approaches are impractical due to thesignificant cost increase. Thus, conventional approaches rely ontemperature characterization in manufacturing to determine each device'sindividual calibration table. For example, oscillator vendors put alarge number of oscillator devices into a temperature chamber andcharacterize the frequency response over temperature. In some cases,vendors produce devices that are internally temperature compensated(e.g., Temperature Compensated Crystal Oscillators (TCXOs)), but thisrequires a Phase Lock Loop (PLL) synthesizer and a processor included inthe oscillator device; of course, this adds significant cost and is thusnot common. Thus, in typical operation, temperature varying electroniccomponents are characterized in temperature chambers in a manufacturingfacility. Such processes are complex, time-consuming, and require largechambers which consume power and space.

It would be advantageous to provide manufacturing automation of in-situtemperature compensation information of electrical components.

BRIEF SUMMARY OF THE DISCLOSURE

In an exemplary embodiment, an in-situ temperature compensation methodof an electronic device and an associated temperature sensor includesproviding airflow from a vortex air gun to a board including theelectronic device and the associated temperature sensor; determining anassociated offset at various temperatures in an operating range; andcreating and storing a calibration table in memory including theassociated offsets at the various temperatures, wherein the calibrationtable is used during operation of the electronic device for compensationdue to temperature variation. The airflow from the vortex air gun can becontrolled to cause temperatures to the electronic device over theoperating range. The airflow can be provided in a similar manner asairflow cooling the board during operation thereby matching temperaturegradients experienced during the operation. The associated offset can bemeasured with reference to a stable frequency reference and the varioustemperatures are measured by the associated temperature sensor. Theassociated offset can be measured with reference to a stable frequencyreference and the various temperatures are measured by the associatedtemperature sensor, and wherein the calibration table can include atwo-tuple of [offset, temperature] for every N degrees in the operatingrange, wherein N is an integer or real number. The electronic device caninclude one of an Oven-Controlled Crystal Oscillator (OCXO) and aTemperature Compensated Crystal Oscillator (TCXO), wherein theassociated offset is measured with reference to a stable frequencyreference can include one of an IEEE1588v2 grandmaster, SynchronousEthernet (SyncE), and Global Positioning System (GPS) signal. Theelectronic device can include one a Field Programmable Gate Array(FPGA), a buffer, and a driver. The determining, the creating, and thestoring steps can be performed by a processor communicatively coupled toand controlling the vortex air gun.

In another exemplary embodiment, an in-situ temperature compensationsystem for an electronic device and an associated temperature sensorincludes a vortex air gun mechanically positioned over a board andadapted to provide airflow over the board at a plurality of temperaturesover an operating range; a processor communicatively coupled to thevortex air gun; and memory storing instructions that, when executed,cause the processor to cause airflow from the vortex air gun to theboard, the electronic device, and the associated temperature sensor,determine an associated offset at various temperatures in an operatingrange, and create and store a calibration table in memory including theassociated offsets at the various temperatures, wherein the calibrationtable is used during operation of the electronic device for compensationdue to temperature variation. The airflow from the vortex air gun can becontrolled to cause temperatures to the electronic device over theoperating range. The airflow can be provided in a similar manner asairflow cooling the board during operation thereby matching temperaturegradients experienced during the operation. The associated offset can bemeasured with reference to a stable frequency reference, and the varioustemperatures are measured by the associated temperature sensor. Theassociated offset can be measured with reference to a stable frequencyreference, and the various temperatures are measured by the associatedtemperature sensor, and wherein the calibration table can include atwo-tuple of [offset, temperature] for every N degrees in the operatingrange, wherein N is an integer or real number. The in-situ temperaturecompensation system of claim 9, wherein the electronic device caninclude one of an Oven-Controlled Crystal Oscillator (OCXO) and aTemperature Compensated Crystal Oscillator (TCXO), wherein theassociated offset can be measured with reference to a stable frequencyreference can include one of an IEEE1588v2 grandmaster, SynchronousEthernet (SyncE), and Global Positioning System (GPS) signal. Theelectronic device can include one a Field Programmable Gate Array(FPGA), a buffer, and a driver.

In a further exemplary embodiment, an electronic system including anelectronic device compensated by an in-situ temperature compensationsystem includes a board, wherein the electronic device is disposed onthe board; a temperature sensor disposed on the board; a processordisposed on the board and communicatively coupled to the electronicdevice and the temperature sensor; and memory storing instructions that,when executed, cause the processor to determine an associated offset atvarious temperatures in an operating range, and create and store acalibration table in memory including the associated offsets at thevarious temperatures, wherein the calibration table is used duringoperation of the electronic device for compensation due to temperaturevariation. The memory storing instructions that, when executed, canfurther cause the processor to cause airflow from a vortex air gun tothe board, the electronic device, and the temperature sensor to causethe various temperatures in the operating range. The associated offsetcan be measured with reference to a stable frequency reference, and thevarious temperatures can be measured by the associated temperaturesensor. The associated offset can be measured with reference to a stablefrequency reference, and the various temperatures are measured by theassociated temperature sensor, and wherein the calibration table caninclude a two-tuple of [offset, temperature] for every N degrees in theoperating range, wherein N is an integer or real number. The electronicdevice can include one of i) one of an Oven-Controlled CrystalOscillator (OCXO) and a Temperature Compensated Crystal Oscillator(TCXO), wherein the associated offset is measured with reference to astable frequency reference can include one of an IEEE1588v2 grandmaster,Synchronous Ethernet (SyncE), and Global Positioning System (GPS)signal; and ii) one a Field Programmable Gate Array (FPGA), a buffer,and a driver.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is illustrated and described herein withreference to the various drawings, in which like reference numbers areused to denote like system components/method steps, as appropriate, andin which:

FIG. 1 is a block diagram illustrates an in-situ characterization systemfor determining temperature characteristics of an electronic componentand an associated temperature sensor, using a vortex air gun;

FIG. 2 is graphs of frequency error as a function of temperature forthree different OCXOs, all from the same manufacturing batch;

FIG. 3 is a graph of a temperature curve for an example TemperatureCompensated Crystal Oscillator (TCXO);

FIG. 4 is a flowchart of an in-situ temperature compensation process ofthe electronic device, the temperature sensor, and the PCB with thein-situ characterization system of FIG. 1;

FIG. 5 is a flowchart of an in-situ temperature compensation process ofthe electronic device, the temperature sensor, and the PCB, performed inthe field, during operation; and

FIG. 6 is a flowchart of another in-situ temperature compensationprocess of an electronic device and an associated temperature sensor.

DETAILED DESCRIPTION OF THE DISCLOSURE

Again, in various exemplary embodiments, the present disclosure relatesto manufacturing automation systems and methods of in-situ temperaturecompensation information of electrical components. The systems andmethods include a servo at manufacturing for building a uniquetemperature compensation table (calibration table). This reduces theneed for expensive external equipment to measure frequency error and aninterface to feed the results back to an onboard software tablecorrelated with temperature. The systems and methods also include avortex air gun rather than a heat chamber in the electronicsmanufacturing plant. These air guns are used for directed heated/cooledairflow for characterizing electronics based on temperature. The systemsand methods can apply to a variety of temperature-sensitive devices,e.g., OCXOs, Field Programmable Gate Arrays (FPGAs), TCXOs, buffers,etc., that might drive a phase-sensitive output. Advantageously, thesystems and methods enable in-situ characterization of electroniccomponents with the exact same temperature sensor and position that willbe used in the field. The temperature sensor is on the product and ispart of what is being calibrated. Temperature sensors can easily have±1° C. accuracy error or more. Thus, the in-situ characterizationenables characterization of the electronic components as well as thetemperature sensor, accurately and efficiently using the vortex air gun.In-situ characterization means the characterized device is surrounded byother components. Also, the vortex air gun can be used to replicateproduct fan airflow rate and direction. In another exemplary embodiment,devices that do not have temperature calibration for in the factory canlearn their environment and correct for temperature. This is especiallyuseful in Global Positioning System (GPS) assisted configurations whereIEEE1588v2 is used as a backup reference, or a device enters holdoverand the environmental temperature changes. IEEE1588v2 is Precision TimeProtocol and is defined in IEEE1588v2 “Standard for a Precision ClockSynchronization Protocol for Networked Measurement and Control System”(2008), the contents of which are incorporated by reference.

Referring to FIG. 1, in an exemplary embodiment, a block diagramillustrates an in-situ characterization system 10 for determiningtemperature characteristics of an electronic device 12 and an associatedtemperature sensor 14, using a vortex air gun 20. The electronic device12 and the temperature sensor 14 can be associated with a PrintedCircuit Board (PCB) 22, a circuit pack, a circuit module, a blade, aline card, a pizza box (1 or 2 Rack Unit (RU) sized device), a pluggablemodule, or any other physical form factor. Again, the electronic device12 is a device that is dependent on temperature with each differentelectronic component having its own temperature response. That is, theelectronic device 12 on one PCB 22 has a different temperature responsefrom another electronic device 12 on another PCB.

Again, the electronic components 12 can include OCXOs, FPGAs, TCXOs,buffers, etc. For example, an OCXO can vary up to ±10 pbb (parts perbillion) with temperature. Thus, in an OCXO, the temperature is thedominant form of frequency error. Referring to FIG. 2, in an exemplaryembodiment, graphs illustrate frequency error as a function oftemperature for three different OCXOs 12 a, 12 b, 12 c all from the samemanufacturing batch. Note, each of the OCXOs 12 a, 12 b, 12 c, whileproviding the same functionality and having the same part number, has aunique temperature response. Also, as described above, each temperaturesensor 14 for the associated OCXOs can also have its own uniqueresponse. Further, the PCB 22 itself, i.e., the direction of airflow,board temperature impedance, etc.) also affects temperature gradients,which can also impact the OCXO 12 a, 12 b, 12 c response. Thus, it isimportant for accuracy to measure and calibrate the response in-situ forthe OCXOs 12 a, 12 b, 12 c, the associated temperature sensors 14 andthe PCBs 22 together, for every device to provide uniquecompensation/calibration.

The electronic device 12 can also be a TCXO. Referring to FIG. 3, in anexemplary embodiment, a graph illustrates a temperature curve for anexample TCXO 12 d. The TCXO 12 d is temperature-compensated, but theystill exhibit temperature variation because they are fundamentallyinexpensive products (e.g., the cut of the crystal, no activetemperature control, etc.).

The electronic device 12 can also be a line driver/buffer, an electronicclock buffer, etc. such as what might be used to drive the 1 pps (pulseper second) output on an Ethernet switch or the like. The delay throughelectronic clock buffers can easily vary by 10% over the temperaturerange.

Referring back to FIG. 1, the systems and methods compensate each device(i.e., the PCB 22) individually in-situ during manufacturing or aftermanufacturing while a device is deployed in the field. It is importantto note that the temperature sensor 14 itself is part of what must becalibrated in the in-situ characterization system 10 as they can be offby ±1° C. and the offset is not necessarily fixed with temperature.

The systems and methods utilize the vortex air gun 20 which uses onlycompressed air to create an air stream of any temperature in the desiredrange (e.g., from −40° C. to +65° C. to cover an entire operating rangeof the PCB 22).

The vortex air gun 20 which can be directed at individual devices, PCBs22, without putting the PCB 22 in a heat chamber, which is expensive andslow. The vortex air gun 20's airflow direction across the electronicdevice 12 (e.g., an OCXO) can be in the same direction and strength asnormal product fan airflow (when the PCB 22 is deployed in a chassis,pizza box, shelf, etc.) This is important since OCXO temperaturegradients can lead to different temperature responses as have confirmedbased on lab testing. The temperature gradient is a physical quantitythat describes in which direction and at what rate the temperaturechanges the most rapidly around a particular location. The temperaturegradient is a dimensional quantity expressed in units of degrees (on aparticular temperature scale) per unit length. Note, the vortex air gun20 can adjust the temperature gradient as well as allow calibrationbased thereon, whereas a heat chamber cannot provide suchcharacterization. The in-situ characterization system 10 can include asingle vortex air gun 20 for creating a typical temperature gradient. Inanother exemplary embodiment, the in-situ characterization system 10 caninclude multiple vortex air guns 20 for creating a specific temperaturegradient.

The vortex air gun 20 includes a vortex tube 30 which receivescompressed air from an input 32. The vortex air gun 20 outputs hot airfrom an output 34, which can also include a control valve 36. The vortexair gun 20 can output cold air from an output 38 on an opposite side ofthe vortex tube 30 from the output 34. The vortex air gun 20 can alsoinclude a mechanical positioning mechanism 40 which can physicallyposition the vortex air gun 20 relative to the PCB 22, the electronicdevice 12, and the temperature sensor 14.

The vortex air gun 20 uses compressed air as a power source, has nomoving parts and produces hot air from the output 34 and cold air fromthe other output 38. The volume and temperature of these two airstreamsare adjustable with the control valve 36 built into the hot air exhaustin the output 34. Temperatures as low as −50° F. (−46° C.) and as highas +260° F. (127° C.) are possible.

In an exemplary embodiment, the PCB 22 includes a processor 50 which canmeasure board temperature (based on communication to the temperaturesensor 14) as well as provide feedback to the vortex air gun 20 forcontrol thereof in stable increments across an entire operating range ofthe PCB 22 (e.g., from −40° C. to +65° C.). The processor 50 can operatepursuant to software instructions executing thereon. The softwareinstructions can cause an on-board PLL to lock to a stable frequencyreference 52 using servo software process. The stable frequencyreference 52 can include an IEEE1588 grandmaster, Synchronous Ethernet(SyncE), GPS, etc. Assuming the electronic device 12 is an OCXO or thelike, the servo software process can yield an FFO (Fractional FrequencyOffset) error value that represents the difference between the localOCXO frequency and the stable frequency reference 52 referencefrequency. A [FFO, temperature] two-tuple can be stored in a tableacross the full temperature range in specific increments, such as 1° C.The table can be stored in onboard such as in non-volatile memory 54 foreach of the electronic devices 12 being calibrated (e.g., OCXO, TCXO,buffer/driver, etc.). Once out in the field, the PCB 22, the process 50,etc. can use the stored tables to compensate the OCXO frequency andbuffer/driver delay at the current temperature. It can interpolatebetween table values as necessary. In order to compensate thebuffer/driver delay, another two-tuple [phase delay, temperature] isrequired in the table.

Referring to FIG. 4, in an exemplary embodiment, a flowchart illustratesan in-situ temperature compensation process 80 of the electronic device12, the temperature sensor 14, and the PCB 22, using the in-situcharacterization system 10. The in-situ temperature compensation process80 includes testing the electronic device for drift rate before andafter characterization to ensure any step change is not due to an agingresponse (step 82). For example, the drift rate of the OCXO is measuredbefore and after the tests in the in-situ temperature compensationprocess 80. If these measurements are substantially different, then theOCXO had a step change in its aging response during the in-situtemperature compensation process 80 and the in-situ temperaturecompensation process 80 must be re-run. Otherwise (if the in-situtemperature compensation process 80 is not re-run), the in-situtemperature compensation process 80 would incorrectly characterize anaging step change as a temperature-induced response.

A stable frequency reference 52 is used for comparison with theelectronic device 12 (step 84). Specifically, the stable frequencyreference 52 is communicatively coupled to a deviceperforming/implementing the in-situ temperature compensation process 80,such as the processor 50. The stable frequency reference 52 is neededfor comparison purposes, to determine an offset at each temperature.That is, the stable frequency reference 52 is used to develop the datain FIG. 2, for example. In particular, the stable frequency reference 52is a comparable electronic device to the electronic device 12 that doesnot have variation over temperature (or a temperature variation and thetemperature is held stable), such that the electronic device 12'svariation can be determined, i.e., the FFO (Fractional Frequency Offset)error value that represents the difference between the local OCXOfrequency and the stable frequency reference 52, at each temperature. Ingeneral, the comparable electronic device is a reference that must haveminimal variation (e.g., drift, aging, temperature, noise, etc.)relative to the variations being compensated in the electronic device12.

The vortex air gun 20 is positioned and aimed at the electronic device12 (step 86). Here, the PCB 22 or the like can be positioned in a rack,test station, etc. and the vortex air gun 20 is positioned, such as viathe mechanical positioning mechanism 40. Again, the in-situ temperaturecompensation process 80 is convenient and efficient, i.e., the in-situtemperature compensation process 80 does not require a heat chamber andthe in-situ temperature compensation process 80 can provide temperaturegradients similar to what is experienced in actual operation in thefield, due to the airflow of the vortex air gun 20 which can be similarto airflow experienced by the PCB 22 in operation in a chassis, shelf,etc. For performing in-situ temperature compensation process 80 in thefactory, the PCB 22 or the like is connected to a test station for data,power, communications to the vortex air gun 20, etc. Step 86 involvesphysical positioning of the PCB 22 so that the calibration can beperformed. The vortex air gun 20 can be aimed at any device on the PCB22. It can be aimed at any device whose delay is being calibrated (e.g.,1 pps output buffer, etc.) with respect to temperature. The vortex airgun 20 allows calibration of one device at a time. However, in anexemplary embodiment, the vortex air gun 20 can include multiple nozzles(e.g., outputs 34, 38) which can be used to direct air to differentlocations on the PCB 22.

The vortex air gun 20 is controlled to adjust the temperature of theelectronic device 12 over an operating range and a corresponding offsetis determined over the operating range based on the stable frequencyreference 52 (step 88). Specifically, the vortex air gun 20 changes thetemperature of the electronic device 12 and the temperature sensor 14.The temperature sensor 14 is adapted to determine a current temperature,based on the output from the vortex air gun 20. At this particulartemperature, the corresponding offset can be determined (e.g., the FFO(Fractional Frequency Offset) error value that represents the differencebetween the local OCXO frequency and the stable frequency reference 52).The processor 50 can be configured to cause the vortex air gun 20 tovary the temperature of the electronic device 12 and the temperaturesensor 14 over the operating range. The corresponding offset can bedetermined at a certain interval, e.g., every degree, every N degreeswhere N is an integer or real number, and the like. In an exemplaryembodiment, an exponential smoothing function can be applied to thecompensation values to reduce effects of noise associated with thetemperature sensor 14. The exponential smoothing function is chosen forits smoothing effect without introducing excessive delay.

Finally, a calibration table is developed based on the correspondingoffsets and stored in memory 54 for use during actual operation in thefield (step 90). The calibration table allows the processor 50 or thelike to provide a correction value for operation in the field at a giventemperature. Referring to FIG. 2, the calibration table can be used toflatten the graphs for the OCXOs 12 a, 12 b, 12 c such that thefrequency pbb is 0 across the entire operating range.

The in-situ temperature compensation process 80 can be used to determinecalibration for any electronic device 12 whose performance is variablewith respect to temperature and whose performance (or error) can bedetermined at each temperature value, such as based on a comparison tothe stable frequency reference 52. The stable frequency reference 52 isa value of how the electronic device 12 should operate without variance.For an OCXO, TCXO, etc., the stable frequency reference 52 can be atiming reference.

For manufacturing, a key aspect is the speed of the in-situ temperaturecompensation process 80 and time taken per PCB 22. The in-situtemperature compensation process 80 can be quite fast since it is alow-mass system (compared to conventional techniques which put the wholePCB 22 in a large, slow temperature chamber), which is also impracticalfor large boards.

Referring to FIG. 5, in an exemplary embodiment, a flowchart illustratesan in-situ temperature compensation process 100 of the electronic device12, the temperature sensor 14, and the PCB 22, performed in the field,during operation. Similar to temperature compensation duringmanufacturing using the in-situ temperature compensation process 80, thetemperature may be compensated when a device is deployed in the fieldusing the in-situ temperature compensation process 100. The electronicdevice 12 can essentially adapt to its environment. Note that thiscompensation in the in-situ temperature compensation process 100 is onlypossible for OCXO output, with the stable frequency reference 52, andnot buffer delay compensation.

After deployment and operation in the field, an electronic device 12 canbe locked to a stable frequency reference 52 (step 102). The stablefrequency reference 52 can be a master clock reference (e.g.,grandmaster, SyncE, GPS, etc.). The electronic device 12 can also takeboard temperature readings, via the temperature sensor 14. If theelectronic device 12 is in a low noise environment (which would be thecase for SyncE and GPS references) a FFO, temperature two-tuppe tablecan be built and stored in non-volatile memory. Specifically, atdifferent temperatures experienced in the field, the correspondingoffset can be determined by the electronic device 12, based on thestable frequency reference 52 (step 104). A calibration table can bebuilt over time, based on the corresponding offsets and the calibrationtable can be stored in memory (step 106). The calibration table can beused as needed such as without the stable frequency reference 52 (step108).

The in-situ temperature compensation process 100 could be useful forcurrent industry trends where deployments are trending toward GPSassisted deployments. Devices are designed to lock to GPS inputs (i.e.,the stable frequency reference 52), with IEEE1588v2 inputs (e.g., OCXOs12 a, 12 b, 12 c) as a backup. Temperature compensation tables (thecalibration table) can be built while locked to the GPS inputs and usedto compensate if GPS lock is lost and the device switches to IEEE1588v2inputs. The systems and methods can also work with GPS only with noIEEE1588 backup. The calibration table can be built while the GPS isoperation, and if the GPS fails, the calibration table can be used tomaintain a stable clock holdover that is not sensitive to temperaturevariation.

If the electronic device 12 is deployed and locked to a grandmaster(e.g., IEEE1588v2) reference, a temperature compensation table can stillbe built. In this case, the 1588v2 software servo process would monitorthe reference clock and only build the two-tuple table in a low PacketDelay Variation (PDV) noise case. This ensures that the table accuratelycorrects for temperature.

Again, the processor 50 can send commands to the vortex air gun 20 for aparticular temperature and airflow set point. The processor 50 on thePCB 22 polls the temperature sensor 14 near the OCXO 12 a, 12 b, 12 cuntil the temperature stabilizes. The servo software process also locksthe on-board PLL to the stable frequency reference 52. Once locked, theservo software process provides the error value and the processor 50stores this value along with the current temperature into a non-volatiletable, in the memory 54. The processor 50 then proceeds to the nexttemperature and repeats until the full temperature range is spanned.

The processor 50 can detect when the temperature reading stabilizes bytaking multiple readings. This allows it to move on to the next readingmore quickly, dependent on the mass of the electronic device 12 beingheated/cooled and the properties of the vortex air gun 12 (air flowrate, reaction time to new temperature setting, etc.). If the electronicdevice 12 is not calibrated in the factory, the same process isapplicable in the field (with or without the vortex air gun 20). Theelectronic device 12 will monitor temperature and build the table whileit is locked to a low noise input reference.

Referring to FIG. 6, in an exemplary embodiment, a flowchart illustratesan in-situ temperature compensation process 150 of an electronic device12 and an associated temperature sensor 14. The in-situ temperaturecompensation process 150 includes providing airflow from a vortex airgun 20 to a board 22 including the electronic device 12 and theassociated temperature sensor 14 (step 152); determining an associatedoffset at various temperatures in an operating range (step 154); andcreating and storing a calibration table in memory 54 including theassociated offsets at the various temperatures, wherein the calibrationtable is used during operation of the electronic device 12 forcompensation due to temperature variation (step 156). The airflow fromthe vortex air gun 20 is controlled to cause temperatures to theelectronic device over the operating range. The airflow is provided in asimilar manner as airflow cooling the board 22 during operation therebymatching temperature gradients experienced during the operation. Theassociated offset is measured with reference to a stable frequencyreference 52, and the various temperatures are measured by theassociated temperature sensor 14.

The associated offset is measured with reference to a stable frequencyreference 52, and the various temperatures are measured by theassociated temperature sensor 14, and wherein the calibration tableincludes a two-tuple of [offset, temperature] for every N degrees in theoperating range, wherein N is an integer or real number. The electronicdevice 12 can include one of an Oven-Controlled Crystal Oscillator(OCXO) and a Temperature Compensated Crystal Oscillator (TCXO), whereinthe associated offset is measured with reference to a stable frequencyreference 52 can include one of an IEEE1588v2 grandmaster, SynchronousEthernet (SyncE), and Global Positioning System (GPS) signal. Theelectronic device 12 can include one a Field Programmable Gate Array(FPGA), a buffer, and a driver. The determining, the creating, and thestoring steps are performed by a processor 50 communicatively coupled toand controlling the vortex air gun 20.

In another exemplary embodiment, the in-situ temperature compensationsystem 10 for an electronic device 12 and an associated temperaturesensor 14 includes a vortex air gun 2-mechanically positioned over aboard 22 and adapted to provide airflow over the board 22 at a pluralityof temperatures over an operating range; a processor 50 communicativelycoupled to the vortex air gun 20; and memory 54 storing instructionsthat, when executed, cause the processor 50 to cause airflow from thevortex air gun 20 to the board 22, the electronic device 12, and theassociated temperature sensor 14, determine an associated offset atvarious temperatures in an operating range, and create and store acalibration table in memory 54 including the associated offsets at thevarious temperatures, wherein the calibration table is used duringoperation of the electronic device 12 for compensation due totemperature variation.

In a further exemplary embodiment, an electronic system includes anelectronic device 12 compensated by an in-situ temperature compensationsystem 10. The electronic system includes a board 22, wherein theelectronic device 12 is disposed to the board 22; a temperature sensor14 disposed to the board 22; a processor 50 disposed to the board 22 andcommunicatively coupled to the electronic device 12 and the temperaturesensor 14; and memory 54 storing instructions that, when executed, causethe processor 50 to determine an associated offset at varioustemperatures in an operating range, and create and store a calibrationtable in memory 54 including the associated offsets at the varioustemperatures, wherein the calibration table is used during operation ofthe electronic device for compensation due to temperature variation.

It will be appreciated that some exemplary embodiments described hereinmay include one or more generic or specialized processors (“one or moreprocessors”) such as microprocessors; Central Processing Units (CPUs);Digital Signal Processors (DSPs): customized processors such as NetworkProcessors (NPs) or Network Processing Units (NPUs), Graphics ProcessingUnits (GPUs), or the like; Field Programmable Gate Arrays (FPGAs); andthe like along with unique stored program instructions (including bothsoftware and firmware) for control thereof to implement, in conjunctionwith certain non-processor circuits, some, most, or all of the functionsof the methods and/or systems described herein. Alternatively, some orall functions may be implemented by a state machine that has no storedprogram instructions, or in one or more Application Specific IntegratedCircuits (ASICs), in which each function or some combinations of certainof the functions are implemented as custom logic or circuitry. Ofcourse, a combination of the aforementioned approaches may be used. Forsome of the exemplary embodiments described herein, a correspondingdevice such as hardware, software, firmware, and a combination thereofcan be referred to as “circuitry configured or adapted to,” “logicconfigured or adapted to,” etc. perform a set of operations, steps,methods, processes, algorithms, functions, techniques, etc. as describedherein for the various exemplary embodiments.

Moreover, some exemplary embodiments may include a non-transitorycomputer-readable storage medium having computer readable code storedthereon for programming a computer, server, appliance, device,processor, circuit, etc. each of which may include a processor toperform functions as described and claimed herein. Examples of suchcomputer-readable storage mediums include, but are not limited to, ahard disk, an optical storage device, a magnetic storage device, a ROM(Read Only Memory), a PROM (Programmable Read Only Memory), an EPROM(Erasable Programmable Read Only Memory), an EEPROM (ElectricallyErasable Programmable Read Only Memory), Flash memory, and the like.When stored in the non-transitory computer readable medium, software caninclude instructions executable by a processor or device (e.g., any typeof programmable circuitry or logic) that, in response to such execution,cause a processor or the device to perform a set of operations, steps,methods, processes, algorithms, functions, techniques, etc. as describedherein for the various exemplary embodiments.

Although the present disclosure has been illustrated and describedherein with reference to preferred embodiments and specific examplesthereof, it will be readily apparent to those of ordinary skill in theart that other embodiments and examples may perform similar functionsand/or achieve like results. All such equivalent embodiments andexamples are within the spirit and scope of the present disclosure, arecontemplated thereby, and are intended to be covered by the followingclaims.

What is claimed is:
 1. An in-situ temperature compensation method of anelectronic device and an associated temperature sensor, the in-situtemperature compensation method comprising: providing airflow from avortex air gun to a board comprising the electronic device and theassociated temperature sensor; determining an associated offset atvarious temperatures in an operating range; and creating and storing acalibration table in memory comprising the associated offsets at thevarious temperatures, wherein the calibration table is used duringoperation of the electronic device for compensation due to temperaturevariation.
 2. The in-situ temperature compensation method of claim 1,wherein the airflow from the vortex air gun is controlled to causetemperatures to the electronic device over the operating range.
 3. Thein-situ temperature compensation method of claim 1, wherein the airflowis provided in a similar manner as airflow cooling the board duringoperation thereby matching temperature gradients experienced during theoperation.
 4. The in-situ temperature compensation method of claim 1,wherein the associated offset is measured with reference to a stablefrequency reference and the various temperatures are measured by theassociated temperature sensor.
 5. The in-situ temperature compensationmethod of claim 1, wherein the associated offset is measured withreference to a stable frequency reference and the various temperaturesare measured by the associated temperature sensor, and wherein thecalibration table comprises a two-tuple of [offset, temperature] forevery N degrees in the operating range, wherein N is an integer or realnumber.
 6. The in-situ temperature compensation method of claim 1,wherein the electronic device comprises one of an Oven-ControlledCrystal Oscillator (OCXO) and a Temperature Compensated CrystalOscillator (TCXO), wherein the associated offset is measured withreference to a stable frequency reference comprises one of an IEEE1588v2grandmaster, Synchronous Ethernet (SyncE), and Global Positioning System(GPS) signal.
 7. The in-situ temperature compensation method of claim 1,wherein the electronic device comprises one a Field Programmable GateArray (FPGA), a buffer, and a driver.
 8. The in-situ temperaturecompensation method of claim 1, wherein the determining, the creating,and the storing steps are performed by a processor communicativelycoupled to and controlling the vortex air gun.
 9. An in-situ temperaturecompensation system for an electronic device and an associatedtemperature sensor, the in-situ temperature compensation systemcomprising: a vortex air gun mechanically positioned over a board andadapted to provide airflow over the board at a plurality of temperaturesover an operating range; a processor communicatively coupled to thevortex air gun; and memory storing instructions that, when executed,cause the processor to cause airflow from the vortex air gun to theboard, the electronic device, and the associated temperature sensor,determine an associated offset at various temperatures in an operatingrange, and create and store a calibration table in memory comprising theassociated offsets at the various temperatures, wherein the calibrationtable is used during operation of the electronic device for compensationdue to temperature variation.
 10. The in-situ temperature compensationsystem of claim 9, wherein the airflow from the vortex air gun iscontrolled to cause temperatures to the electronic device over theoperating range.
 11. The in-situ temperature compensation system ofclaim 9, wherein the airflow is provided in a similar manner as airflowcooling the board during operation thereby matching temperaturegradients experienced during the operation.
 12. The in-situ temperaturecompensation system of claim 9, wherein the associated offset ismeasured with reference to a stable frequency reference, and the varioustemperatures are measured by the associated temperature sensor.
 13. Thein-situ temperature compensation system of claim 9, wherein theassociated offset is measured with reference to a stable frequencyreference, and the various temperatures are measured by the associatedtemperature sensor, and wherein the calibration table comprises atwo-tuple of [offset, temperature] for every N degrees in the operatingrange, wherein N is an integer or real number.
 14. The in-situtemperature compensation system of claim 9, wherein the electronicdevice comprises one of an Oven-Controlled Crystal Oscillator (OCXO) anda Temperature Compensated Crystal Oscillator (TCXO), wherein theassociated offset is measured with reference to a stable frequencyreference comprises one of an IEEE1588v2 grandmaster, SynchronousEthernet (SyncE), and Global Positioning System (GPS) signal.
 15. Thein-situ temperature compensation system of claim 9, wherein theelectronic device comprises one a Field Programmable Gate Array (FPGA),a buffer, and a driver.
 16. An electronic system comprising anelectronic device compensated by an in-situ temperature compensationsystem, the electronic system comprising: a board, wherein theelectronic device is disposed on the board; a temperature sensordisposed on the board; a processor disposed on the board andcommunicatively coupled to the electronic device and the temperaturesensor; and memory storing instructions that, when executed, cause theprocessor to determine an associated offset at various temperatures inan operating range, and create and store a calibration table in memorycomprising the associated offsets at the various temperatures, whereinthe calibration table is used during operation of the electronic devicefor compensation due to temperature variation.
 17. The electronic systemof claim 16, wherein the memory storing instructions that, whenexecuted, further cause the processor to cause airflow from a vortex airgun to the board, the electronic device, and the temperature sensor tocause the various temperatures in the operating range.
 18. Theelectronic system of claim 16, wherein the associated offset is measuredwith reference to a stable frequency reference, and the varioustemperatures are measured by the associated temperature sensor.
 19. Theelectronic system of claim 16, wherein the associated offset is measuredwith reference to a stable frequency reference, and the varioustemperatures are measured by the associated temperature sensor, andwherein the calibration table comprises a two-tuple of [offset,temperature] for every N degrees in the operating range, wherein N is aninteger or real number.
 20. The electronic system of claim 16, whereinthe electronic device comprises one of i) one of an Oven-ControlledCrystal Oscillator (OCXO) and a Temperature Compensated CrystalOscillator (TCXO), wherein the associated offset is measured withreference to a stable frequency reference comprises one of an IEEE1588v2grandmaster, Synchronous Ethernet (SyncE), and Global Positioning System(GPS) signal; and ii) one a Field Programmable Gate Array (FPGA), abuffer, and a driver.